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ABF Substrates Supplier . Smallest gap ABF Substrates manufacturer from 4 Schicht zu 14 Lagen. when we use the Sap technology. we need to choose the ABF base materials to produce the substrates. we can produce 10 layer o to 14 layer HDI substrates. the substrates gap and trace are…

Hersteller von ABF-Substraten. .We use advanced MSAP and SAP production technology to process and produce high multilayer ABF substrates and FC-BGA substrates. We have made the substrates from 4 Schicht zu 14 Lagen.

Introduction Printed circuit boards (Leiterplatten) ermöglichen es Ihnen, die Designfunktionen in Ihrem Prototyp zu überprüfen. Sie sind einfach herzustellen, und Sie können Ihre Entwürfe testen und bei Bedarf etwaige Fehler korrigieren, bevor Sie Ihre Ressourcen der vollständigen Produktion widmen. You save a lot of time and money testing out…

Rogers RT/duroid® 5880LZ PCB maker. Dk of 2.00 +/- .04, Low dissipation factor ranging from .0021 to .0027 at 10GHz, Low density of 1.4 gm/cm3, Low Z-axis coefficient of thermal expansion at 40 ppm/°C.

Rogers RT/duroid® 6002 PCB-Herstellung. Dielectric constant (Dk) of 2.94 +/- .04, Dissipation factor of .0012 at 10GHz, Low thermal coefficient of Dk at 12 ppm/°C, Low Z-axis coefficient of thermal expansion at 24 ppm/°C.

Antenna PCB Manufacturing. Antenna Rogers RT/duroid 5880 high frequency PCBs. Low dielectric constant (Dk 2.2) . Dissipation factor of .0009 at 10GHz. and Low moisture absorption. The Antenna PCB was made with High Frequency materials.