Rogers Ro4000 Platine
Rogers Ro4000 Leiterplattenherstellung, RO4000® LoPro® Series/High Frequency Circuit Fabrication. Cavity Rogers PCBs. Herstellung von HDI-Leiterplatten und Rigers-Flex-Leiterplatten.Panasonic Megtron-Platine
Panasonic Megtron PCB Fabrication ,Megtron 6 Leiterplatte, Megtron 7, Megtron 8 Leiterplatte, Low Loss High Speed Cavity PCB Fabrication , ROGERS RT5880 Fabrication, ROGERS RT6002 Fabrication. ROGERS RO3003 RO3010 RO4350 RO4850 PCB Manufacturer, Rigid-Flex with HDI PCB Manufacturer.RT-Duroid 6035 Leiterplatte
RT-Duroid 6035 Leiterplatte, Rt 6035 PCB-Herstellung, RT/duroid 6035HTC laminates are an exceptional choice for high power applications. The laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, und Kupferfolie (ED and reverse treat) with excellent long term thermal stability. Zusätzlich, Rogers advanced filler…RT/duroid® 5880 Leiterplatte
oid® 5880 Leiterplatte, RT5880 PCB board. Alcanta factory produce RT 5880 material Boards from 2 Schicht zu 20 Lagen. HDI RT5870 materials, RT5880 materials. Rt 6002 Materialien, Cavtiy PCBs. high quality HDI PCBs, and fast shipping time.BGA-Substrate PCB
BGA Substrates PCB Fabrication. Alcanta PCB has made many 2 Schicht zu 10 layers BGA Substrates PC Board. and the drilling ways are any layers interconnection. high quality and fast shipping time.FC-BGA-Substrate
FC-BGA-Substrate (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions. We have developed ultra high density wiring substrates with our original microfabrication and build-up wiring technologies, offering products supporting current semiconductor microfabrication.For a growing demand for LSIs for…
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