News Archives - Ukurasa 64 ya 101 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD

What is the substrate of the flip chip package?
Novemba 6, 2023 Habari / Habari za Biashara
We are a professional flip chip package substrate, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate and PCBs. Flip chip packaging, a cutting-edge technology in the world of electronic engineering, has revolutionized the way microchips and electronic components are connected and packaged. Katika nakala hii,…
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Are the two most common materials used in an IC package?
Novemba 6, 2023 Habari / Habari za Biashara
Different types of ic packaging substrates manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology. In the realm of modern electronic devices, the Integrated Circuit Package Substrate (IC package substrate) plays a pivotal role, serving as the crucial link between microchips and the…
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What are the rules of packaging?
Novemba 3, 2023 Habari za Kampuni / Habari / Habari za Biashara
Design rules of substrate in packaging manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology. In today's digital age, a new era of electronic devices and technology is evolving rapidly. One of the drivers of this advancement is packaging technology and substrate design…
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Je! Ni nini matumizi ya kauri katika umeme?
Novemba 3, 2023 Habari / Habari za Biashara
Ceramic substrates and packages.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology. Ceramics, often associated with fragility and artistic craftsmanship, actually occupy a pivotal place in the realm of electronics. Beyond their decorative aspects, ceramics serve as essential components in a diverse array…
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Je! Ni tofauti gani kati ya vifurushi vya BGA na FBGA?
Novemba 2, 2023 Habari / Habari za Biashara
Mtengenezaji wa muundo wa kifurushi cha BGA.. Katika vifaa vya elektroniki, Safu ya gridi ya mpira (BGA) na safu nzuri ya gridi ya mpira (FBGA) Ufungaji umekuwa mada mbili moto kwenye uwanja wa teknolojia ya ufungaji. BGA is a common packaging type,…
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Antenna Shield kifurushi cha kifurushi
Novemba 2, 2023 Habari / Habari za Biashara
Unlocking the Power of Antenna Shield Package Substrates: Learn how this essential component enhances electronics, emphasizes innovation, and promotes sustainability. Dive into the future of electronic connectivity!
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