Jalada la habari - Ukurasa 62 ya 101 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 62

We are a professional Package substrate process, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, Ultra-small Trace na nafasi ya ufungaji wa nafasi na PCB. In today's digital era, electronic devices gradually penetrate people's daily lives, from smartphones to household appliances, all without advanced electronic manufacturing technology. As the core component of electronic…

Package substrate modulus and package substrate manufacturer. Tunatumia teknolojia ya hali ya juu ya MSAP na SAP, Sehemu ndogo za unganisho za multilayer kutoka 4 kwa 18 tabaka. Sehemu ndogo za ufungaji, as an integral part of electronic devices, Cheza jukumu muhimu. In the wave of modern technology, it undertakes multiple tasks such as supporting electronic…

Sisi ni vifaa vya kitaalam vya vifaa vya kitaalam CTE, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, Ultra-small Trace na nafasi ya ufungaji wa nafasi na PCB.

Sisi ni soko la kitaalam la kifurushi, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, Ultra-small Trace na nafasi ya ufungaji wa nafasi na PCB. Sehemu ndogo za ufungaji, kama sehemu muhimu ya umeme wa kisasa, Cheza jukumu muhimu. Jukumu lake la msingi sio tu kwa kutoa msaada na miunganisho kwa vifaa vya elektroniki,…

Package substrate core. Tunatumia teknolojia ya hali ya juu ya MSAP na SAP, Sehemu ndogo za unganisho za multilayer kutoka 4 kwa 18 tabaka. In the contemporary design of electronic equipment, the layout design of packaging substrates assumes a pivotal role, influencing not only the performance and reliability of electronic products but also directly impacting…

Package substrate dielectric market, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate. Katika tasnia ya kisasa ya umeme, Package Substrate Dielectric plays a vital role. With the continuous development of electronic equipment, the demand for high-performance packaging substrates is growing. As the core component of the…