Jalada la habari - Ukurasa 60 ya 101 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 60

Kifurushi cha ufungaji. Tunatumia teknolojia ya hali ya juu ya MSAP na SAP, Sehemu ndogo za unganisho za multilayer kutoka 4 kwa 18 tabaka,

Flip Chip Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

Sisi ni maendeleo ya teknolojia ya ufundi wa kitaalam, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, Ultra-small Trace na nafasi ya ufungaji wa nafasi na PCB.

We are a professional Substrate for semiconductor packaging, we mainly produce ultra-small trace and spacing packaging substrate and PCBs.

We are a professional Substrate cross section ic package, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, Ultra-small Trace na nafasi ya ufungaji wa nafasi na PCB. Katika uwanja wa vifaa vya elektroniki vya kisasa, packaging substrates are key components of electronic devices and play an important role in facilitating circuit connections, improving performance and…

We are a professional Semiconductor package substrates, we mainly produce ultra-small trace and spacing packaging substrate and PCBs. In the rapidly evolving landscape of the electronics industry, semiconductor packaging substrates have emerged as indispensable catalysts for technological advancement. This article aims to offer a comprehensive exploration of the fundamental concepts…