Jalada la habari - Ukurasa 59 ya 101 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD

Je! Ni sehemu gani ndogo ya kifurushi?
Desemba 14, 2023 Habari / Habari za Biashara
Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process.
Soma zaidi
Je! Ni nini flip chip ufungaji substrate?
Desemba 13, 2023 Habari / Habari za Biashara
Produce top-tier Flip Chip Packaging Substrate with 100um bump pitch, 9kuwaeleza, na pengo la 9um kwa utendaji mzuri.
Soma zaidi
Je! Ni nini substrate ya BGA?
Desemba 12, 2023 Habari / Habari za Biashara
BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials.
Soma zaidi
What is FCBGA packaging technology?
Desemba 11, 2023 Habari / Habari za Biashara
We are a professional FCBGA Packaging, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and PCBs.
Soma zaidi
What is FCBGA Package?
Desemba 8, 2023 Habari / Habari za Biashara
We are a professional FCBGA package, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate.
Soma zaidi
What is the definition of FCBGA Package Substrate?
Desemba 7, 2023 Habari / Habari za Biashara
FCBGA package Substrate.High speed material packaging substrate manufacturing. Advanced packaging substrate production process.
Soma zaidi