Jalada la habari - Ukurasa 57 ya 101 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 57

Sehemu ndogo ya kifurushi cha kauri. tunaweza kutoa lami bora zaidi ya samllest na 100um, alama ndogo zaidi ni 9um.

Semiconductor substrate supplier. tunaweza kutoa lami bora zaidi ya samllest na 100um, alama ndogo zaidi ni 9um.

Semiconductor FC BGA substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

We are a professional Semiconductor BGA substrate, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, Ultra-small Trace na nafasi ya ufungaji wa nafasi na PCB.

Rigid-Flex BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Rigid-Flex Packaging Substrate. tunaweza kutoa lami bora zaidi ya samllest na 100um, alama ndogo zaidi ni 9um.