What is FCBGA packaging substrate?
FCBGA packaging substrate: Optimal 100um bump pitch, 9um trace and gap for compact design. Typical: 15-30um trace and spacing.
What is Package Substrate?
Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process.
What is Flip Chip Packaging Substrate?
Produce top-tier Flip Chip Packaging Substrate with 100um bump pitch, 9um trace, and 9um gap for optimal performance.
What is BGA Substrate?
BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials.
What is FCBGA packaging technology?
We are a professional FCBGA Packaging, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and PCBs.
What is FCBGA Package?
We are a professional FCBGA package, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate.
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