Jalada la habari - Ukurasa 53 ya 101 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 53

Embedded Cavity PCB Substrate Manufacturer. High speed and high frequency material Cavity packaging substrate and Cavity slot PCB manufacturing.

FCCSP Flip Chip CSP package substrates Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection FCCSP Flip Chip CSP package substrates. and we also do the FCCSP package service.

Cavity PCB Substrate mtengenezaji. Professional Cavity PCB and Embedded component substrates factory. We use advanced embedded production processes.

Flip Chip CSP (FCCSP) Thabiti. Tunazalisha kasi ya juu na kiwango cha juu cha vifaa vya ufungaji kutoka 2 Tabaka kwa 20 tabaka. Tunatoa pia huduma ya kifurushi cha Flip Chip CSP.

Ceramic package substrate Manufacturer, Bodi ya mzunguko wa kauri na sehemu ndogo za kifurushi cha BGA za kauri. tunatoa microtrace/microgap HDI Ceramic PCBs na kauri BGA substrates kutoka 1 Tabaka kwa 30 tabaka.

Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.