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Rigid-Flex Packaging Substrate. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

We are a professional Semiconductor substrate, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and PCBs.

Ceramic Packaging Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.high frequency materials.

Sisi ni wataalamu wa IC Substrate, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate and PCBs.

We are a professional ABF Substrate Manufacturer, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate.

FCBGA substrate: Optimal 100um bump pitch, 9um trace and gap for compact design. Typical: 15-30um trace and spacing.