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Ceramic Packaging Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.high frequency materials.

Sisi ni wataalamu wa IC Substrate, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate and PCBs.

We are a professional ABF Substrate Manufacturer, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate.

FCBGA substrate: Optimal 100um bump pitch, 9um trace and gap for compact design. Typical: 15-30um trace and spacing.

FCBGA packaging substrate: Optimal 100um bump pitch, 9um trace and gap for compact design. Typical: 15-30um trace and spacing.

Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process.