Jalada la habari - Ukurasa 58 ya 101 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 58

We are a professional Semiconductor substrate, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and PCBs.

Ceramic Packaging Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.high frequency materials.

Sisi ni wataalamu wa IC Substrate, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, Ultra-small Trace na nafasi ya ufungaji wa nafasi na PCB.

We are a professional ABF Substrate Manufacturer, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate.

Sehemu ndogo ya FCBGA: Bomba la mapema la 100um, 9Um kuwaeleza na pengo la muundo wa kompakt. Kawaida: 15-30Um kuwafuata na nafasi.

FCBGA packaging substrate: Bomba la mapema la 100um, 9Um kuwaeleza na pengo la muundo wa kompakt. Kawaida: 15-30Um kuwafuata na nafasi.