Diverse Application Fields of Packaging Substrate
We have made Quick-turn-circuit-boards. to produce the quick turn boards. we only need 1 또는 2 날. the PCB via holes are 0.15mm. line to line spacing is 0.08mm. pcb boards thick is 0.2mm to 3.0mm. pcb copper thick is 35um to 210um. about the pcb soldermask colour. we can…
플립 칩 패키지 기판 제조업체
Professional Flip-Chip Package Substrate Manufacturer. we offer Flip Chip Packaging Substrate from 4 레이어 18 레이어. the smallest pitch are 100um. the smallest trace and spacing are 9um/9um.
고급 포장 공정이란 무엇입니까??
FC BGA 패키지란 무엇입니까?? FC BGA 패키지 참조 가이드. and How Much Does FC BGA Packaging Cost? We offer FC BGA from 4 레이어 18 layer
플립칩 패키지 기판 기술
Alcanta substrate company has made many high High multilayer Flip-Chip Package Substrates. 와 같은: 10 layer Flip-Chip Package Substrates. 12 layer. 14 layer. 또는 16 layers substrates. the drilling ways is anylayer connect. the best sallest via size is 50um. we can use the Msap or Sap technology to make…
Ultra-Small Pitch Substrate
Ultra-Small Pitch Substrate manufacturer. Ultra-Small Spacing PCB manufacture. The Substrate was made with advanced Msap or Sap technology. 그래서. we can produce 9um/9um trace/spacing Substrate or PCBs. the lead time is fast. and Stable quality!
고급 패키지 기판
Advanced Package Substrate manufacturer. We have used Msap and Sap technological process to produce the Package substrates with the Rogers Materials BT Materials, ABF Materials, and other types Materials. The range of main layers of our products is from 4 레이어 18 레이어. our company asways made the 10…
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