News Archives - 페이지 64 ~의 101 - 알칸타 기술(선전)주식회사 - 페이지 64

We are a professional flip chip package substrate, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate and PCBs. Flip chip packaging, a cutting-edge technology in the world of electronic engineering, has revolutionized the way microchips and electronic components are connected and packaged. 이 기사에서,…

Different types of ic packaging substrates manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology. In the realm of modern electronic devices, the Integrated Circuit Package Substrate (IC package substrate) plays a pivotal role, serving as the crucial link between microchips and the…

Design rules of substrate in packaging manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology. In today's digital age, a new era of electronic devices and technology is evolving rapidly. One of the drivers of this advancement is packaging technology and substrate design…

Ceramic substrates and packages.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology. Ceramics, often associated with fragility and artistic craftsmanship, actually occupy a pivotal place in the realm of electronics. Beyond their decorative aspects, ceramics serve as essential components in a diverse array…

BGA 패키지 기판 설계 제조업체. 높은 속도 및 고주파 재료 포장 기판 제조. 조정 포장 기판 생산 공정 및 기술. 전자 장비에서, 볼 그리드 어레이 (BGA) 및 미세 피치 볼 그리드 어레이 (FBGA) 포장은 포장 기술 분야에서 두 가지 뜨거운 주제가되었습니다.. BGA is a common packaging type,…

Unlocking the Power of Antenna Shield Package Substrates: Learn how this essential component enhances electronics, emphasizes innovation, and promotes sustainability. Dive into the future of electronic connectivity!