News Archives - Ukurasa 72 ya 101 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 72

FCBGA package&FCBGA Substrate,Sehemu ndogo ya kifurushi cha Flip-Chip, we have made the ball Pitch 160um(6.3mil). laser via drill size 70um(2.75mil). na 25um(1mil) Kwa laser kupitia pete ya shaba. the pad to pad gap are 30um(1.2mil). Teknolojia ya juu ya kifurushi cha FCBGA.

Mtengenezaji wa juu wa PCB. High end HDI PCB Factory. High precision circuit board production. We offer The High end HDI PCB boards from 4 Layer to 100 tabaka. Advanced production technologies.High quality grade!

Backdrilling PCB Fabrication, Back drilling HDI PCB board Manufacturing. Back drilling (a.k.a controlled depth drilling or CDD) involves using a drill bit slightly larger in diameter than the PTH to remove the conductive plating or stub from the hole. In practice this is achieved by re-drilling the PTH down to…

Ultrathin Bluetooth PCB Fabrication. Smallest size Bluetooth Circuits Manufacturing. Ultrathin Multilayer Bluetooth PCB manufacturers. Ultrathin Bluetooth PCB. Low cost and High quality.

Ceramic Substrate PCB Fabrication. Ceramic Multilayer PCB Manufacturing, Ceramic substrate refers to a special process board where copper foil is directly bonded to the surface (single side or double side) of alumina (AL2O3) au nitridi ya aluminium (Aln) ceramic substrate at high temperature. Compared with traditional FR-4 or aluminum substrate, the…

Megtron7GE Multilayer PCB Fabrication.R-5785(GE) & R-5680(GE) Utengenezaji wa PCB. and R5785(GN)&R5680(GN) Viwanda vya PCB. Alcanta PCB company offer Megtron7 series circuit board with Quality grade IPC Class 3. the PCB quality is perfect! Ultra-low transmission loss Highly heat resistant Multi-layer circuit board materials MEGTRON7 | R-5785(GN), R-5785(GE), R-5785. We have used these…