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Herstellung von Mikrokavitätssubstraten. Open a micro Cavity on the PCBs or BGA package substrates. we have made many cavity PCBs from 4 Schicht zu 30 Lagen. high quality and fast lead times.

Bt laminate PCB manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high.

Herstellung von Hohlraumsubstraten. High speed and high frequency material Cavity packaging substrate manufacturing. Advanced cavity(Slot) production technique. we make the cavity PCBs from 4 Schicht zu 30 Lagen.

Herstellung von Bt-Laminatsubstraten, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Spuren- und Abstandsverpackungssubstrat.

Herstellung ultradünner BT-Leiterplatten, we mainly produce Ultrathin and ultra-small bump pitch BGA substrate, ultra-small trace and spacing LED PCBs, and other types BGA package substrate.

Professional Low CET PCB manufacturing, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, ultra-small trace and spacing PCB and package substrate.