Trade News Archives - Seite 45 von 94 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 45

Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Hersteller von Substratverpackungen. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 Zu 18 Lagen,

Spitze 10 Hersteller von Verpackungssubstraten, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, ultra-small trace packaging substrate from 2~20L

Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 Schicht zu 20 Lagen.

Global Packaging Substrate Manufacturer. Mit 100 µm können wir den kleinsten Bump-Pitch herstellen, the best smallest trace are 9um.

Spitze 10 Paket Substrathersteller. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 Schicht zu 20 Lagen.