Bt laminate substrate manufacturing
Bt laminate substrate manufacturing, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing packaging substrate.
Ultrathin BT PCB manufacturing
Ultrathin BT PCB manufacturing, we mainly produce Ultrathin and ultra-small bump pitch BGA substrate, ultra-small trace and spacing LED PCBs, and other types BGA package substrate.
Low CET PCB Manufacturing
Professional Low CET PCB manufacturing, we mainly produce ultra-small bump pitch substrate, ultra-small trace and spacing PCB and package substrate.
Ultrathin BT PCB Manufacturing
Ultrathin BT PCB manufacturing. we can produce the best samllest thin PCB with 0.07mm, the best smallest trace and spacing are 9um/9um.
Rigid-Flex Packaging Substrate Firm
Rigid-flex packaging substrate Firm. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates.
Semiconductor FC-BGA substrate Manufacturer
Semiconductor FC-BGA substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection.
Tel: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com