Trade News Archives - ページ 48 の 94 - アルカンタテクノロジー(深セン)株式会社 - ページ 48

FCCSPフリップチップパッケージ基板メーカー. 100umで最高のSamllestバンプピッチを作成できます, 最も小さなトレースと間隔は9um/9umです. アジノモトを使用してください(ABF) 基本材料またはその他のタイプ高周波数および高速基板材料.

BGA Cavity Substrate Manufacturer. We are professional Cavity PCB & Embedded components and parts substrates company. We can do the cavity slot with the Mixed dielectric layer.

Organic Packaging Manufacturer. We use advanced Msap and Sap technology to make the High multilayer interconnection package substrates from 4 に 20 レイヤー. and our company also do the Organic Packaging service.

BT FCCSP Package Substrate Manufacturer. the Package Substrate will be made with BT base, Showa Denko and Ajinomoto High speed materials. or other types High speed and high frequency materials.

CSP package substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate firm.

フリップチップCSPパッケージ基板メーカー. High speed and high frequency material packaging substrate manufacturing.Advanced technology and equipments.