Trade News Archives - Pagină 49 de 94 - TEHNOLOGIA ALCANTA(SHENZHEN)CO., LTD - Pagină 49

Flip Chip CSP Package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing.Advanced technology and equipments.

Professional Wire Bond Substrate Manufacturer, producem în principal substrat cu pas cu denivelare ultra-mic, ultra-small trace and led PCBs from 2 strat la 20 straturi.

Cavity Substrate PCB Manufacturer. High speed and high frequency material cavity packaging substrate and Cavity PCB boards manufacturing. Advanced production technology.

Chip-scale package and scale package substrates Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging service vendor.

Producător de substrat PCB cu cavitate încorporată. High speed and high frequency material Cavity packaging substrate and Cavity slot PCB manufacturing.

FCCSP Flip Chip CSP pachet substraturi Producator. Folosim tehnologia avansată Msap și Sap pentru a produce substraturi de pachete FCCSP Flip Chip CSP cu interconexiune multistrat înalt. și facem, de asemenea, serviciul de pachete FCCSP.