Flip Chip CSP (FCCSP) Firm
Flip Chip CSP (FCCSP) Firm. We produce the High speed and high frequency material packaging substrate from 2 camada para 20 camadas. we also offer the Flip Chip CSP package service.
What is Ceramic package substrate?
Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 camada para 30 camadas.
What is a semiconductor BGA substrate?
Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
What is a semiconductor FC BGA substrate?
Semiconductor FC BGA substrate quote. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
What is Rigid-Flex BGA Substrate?
We are a professional Rigid-flex BGA substrate quote, we mainly produce ultra-small bump pitch substrate, ultra-small trace and PCBs.
What is Rigid-Flex Packaging Substrate?
We are a professional Rigid-flex packaging substrate quote supplier, we mainly produce ultra-small bump pitch substrate, ultra-small trace.
Telefone: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com