News Archives - TECNOLOGIA ALCANTA(SHENZHEN)CO., LTD

Custom BGA/IC Substrates play a crucial role in modern semiconductor packaging, serving as the bridge between the silicon chip and the printed circuit board (PCB). IC substrates provide electrical connections, Suporte mecânico, and thermal dissipation pathways, ensuring the functionality and reliability of advanced electronic devices. Among various packaging technologies, Ball…

The rapid evolution of semiconductor technology has driven the need for more advanced packaging solutions to meet the increasing demands of high-performance computing, IA, and data-intensive applications. Traditional organic and silicon-based substrates are facing limitations in electrical performance, gerenciamento térmico, and miniaturization. As a result, Custom Glass Class Package Substrate…

Um quadro de chumbo QFN/QFP personalizado é uma estrutura de metal especializada projetada para fornecer conexões elétricas, Suporte mecânico, e dissipação térmica para dispositivos semicondutores usando QFN (Quad Flat No Lead) ou qfp (Pacote quad planície) embalagem. Esses quadros de chumbo são adaptados para atender aos requisitos específicos de design e desempenho, ensuring optimal functionality in…

Custom FCBGA Package Substrate Service plays a pivotal role in advancing modern semiconductor packaging solutions. As a tailored service, it focuses on designing and manufacturing specialized substrates for FCBGA (Flip-Chip Ball Grid Array) embalagem, a technology widely recognized for its high-performance and miniaturization capabilities. FCBGA packaging relies on flip-chip technology…

Semiconductor packaging plays a crucial role in modern electronics, serving as the bridge between integrated circuits (ICS) and external components. It not only protects delicate semiconductor chips but also ensures efficient electrical connections and thermal management. As electronic devices become more compact and powerful, advanced packaging solutions are essential to…

The Small Outline Integrated Circuit (Bocais) is a compact, surface-mount technology (SMT) package widely used in the electronics industry. Known for its small size and ease of assembly, SOIC is ideal for space-constrained applications like consumer electronics, automotive systems, and communication devices. It offers a balance between functionality and cost-effectiveness,…