Trade News Archives - Seite 56 of 94 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 56

BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials.

Wir sind eine professionelle FCBGA -Verpackung, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Trace und PCBs.

We are a professional FCBGA package, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Spuren- und Abstandsverpackungssubstrat.

FCBGA package Substrate.High speed material packaging substrate manufacturing. Advanced packaging substrate production process.

Packaging Substrate. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 Zu 18 Lagen,

Flip Chip Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.