Trade News Archives - Seite 56 of 94 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 56

We are a professional FCBGA Packaging, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, ultra-small trace and PCBs.

We are a professional FCBGA package, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Spuren- und Abstandsverpackungssubstrat.

FCBGA package Substrate.High speed material packaging substrate manufacturing. Advanced packaging substrate production process.

Packaging Substrate. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 Lagen,

Flip Chip Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.

We are a professional Substrate package technology development Inte, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, ultra-small trace and spacing packaging substrate and PCBs.