Trade News Archives - Seite 55 of 94 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 55

We are a professional IC Substrate, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, ultra-small trace and spacing packaging substrate and PCBs.

We are a professional ABF Substrate Manufacturer, Wir produzieren hauptsächlich ein ultra-kleines Bump-Tonhöhe-Substrat, Ultra-kleiner Spuren- und Abstandsverpackungssubstrat.

FCBGA substrate: Optimal 100um bump pitch, 9um trace and gap for compact design. Typical: 15-30um trace and spacing.

FCBGA packaging substrate: Optimal 100um bump pitch, 9um trace and gap for compact design. Typical: 15-30um trace and spacing.

Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process.

Produce top-tier Flip Chip Packaging Substrate with 100um bump pitch, 9um trace, and 9um gap for optimal performance.