무역 뉴스 보관소 - 페이지 59 ~의 94 - 알칸타 기술(선전)주식회사 - 페이지 59

우리는 전문적인 패키지 기판 재료 cte입니다, 초소형 범프 피치 기판을 주로 생산하고 있습니다., 초소형 트레이스 및 간격 패키징 기판 및 PCB.

We are a professional Package substrate market, 초소형 범프 피치 기판을 주로 생산하고 있습니다., 초소형 트레이스 및 간격 패키징 기판 및 PCB. Packaging substrates, as an integral part of modern electronics, play a key role. Its core role is not only limited to providing support and connections for electronic components,…

Package substrate core. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 에게 18 레이어. In the contemporary design of electronic equipment, the layout design of packaging substrates assumes a pivotal role, influencing not only the performance and reliability of electronic products but also directly impacting…

Package substrate dielectric market, 초소형 범프 피치 기판을 주로 생산하고 있습니다., ultra-small trace and spacing packaging substrate. 현대 전자산업에서는, Package Substrate Dielectric plays a vital role. With the continuous development of electronic equipment, the demand for high-performance packaging substrates is growing. As the core component of the…

Package substrate core and package substrate manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 에게 18 레이어. Packaging substrates, as pivotal components of electronic equipment, play an indispensable role in the modern electronic landscape. They serve as the foundation for electronic devices, offering crucial…

We are a professional Organic substrates meaning electronic packaging, 초소형 범프 피치 기판을 주로 생산하고 있습니다., 초소형 트레이스 및 간격 패키징 기판 및 PCB. Organic substrates represent a fundamental concept within the realm of electronic packaging.  A thorough comprehension of organic substrates is instrumental in enhancing our insights into contemporary…