무역 뉴스 보관소 - 페이지 57 ~의 94 - 알칸타 기술(선전)주식회사 - 페이지 57

우리는 기판패키지 기술개발 전문기업입니다., 초소형 범프 피치 기판을 주로 생산하고 있습니다., 초소형 트레이스 및 간격 패키징 기판 및 PCB.

We are a professional Substrate for semiconductor packaging, we mainly produce ultra-small trace and spacing packaging substrate and PCBs.

We are a professional Substrate cross section ic package, 초소형 범프 피치 기판을 주로 생산하고 있습니다., 초소형 트레이스 및 간격 패키징 기판 및 PCB. 현대 전자 분야에서는, packaging substrates are key components of electronic devices and play an important role in facilitating circuit connections, improving performance and…

We are a professional Semiconductor package substrates, we mainly produce ultra-small trace and spacing packaging substrate and PCBs. In the rapidly evolving landscape of the electronics industry, semiconductor packaging substrates have emerged as indispensable catalysts for technological advancement. This article aims to offer a comprehensive exploration of the fundamental concepts…

bt-materials-pcb. we have produced boards with BT material. This material has different thicknesses. Like: 0.1mm. 0.15mm.0.2mm.0.25mm.0.3mm to 1.6mm. We produce the BT PCB with High quality and fast lead time. BT resin materials have excellent mechanical, 열의, and electrical properties.

We are a professional Pathfinding department substrate and packaging technology development, we mainly produce ultra-small trace and PCBs. In the current landscape of rapid technological advancement, the Pathfinding Department stands as a linchpin in the realm of packaging technology. As a vanguard within the engineering domain, the department's commitment to…