What is BGA Substrate?
BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high speed materials.
What is FCBGA packaging technology?
We are a professional FCBGA Packaging, 초소형 범프 피치 기판을 주로 생산하고 있습니다., ultra-small trace and PCBs.
What is FCBGA Package?
We are a professional FCBGA package, 초소형 범프 피치 기판을 주로 생산하고 있습니다., ultra-small trace and spacing packaging substrate.
What is the definition of FCBGA Package Substrate?
FCBGA package Substrate.High speed material packaging substrate manufacturing. Advanced packaging substrate production process.
Have You Wondered What Packaging Substrate Really Is?
포장 기판. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 에게 18 레이어,
플립칩 패키지 기판이란??
Flip Chip Package Substrate.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production process and technology.
전화: +86 (0)755-8524-1496
이메일: info@alcantapcb.com