Trade News Archives - Seite 67 von 94 - ALCANTA-TECHNOLOGIE(SHENZHEN)CO.,LTD - Seite 67

FC-BGA-Substrate (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions. We have developed ultra high density wiring substrates with our original microfabrication and build-up wiring technologies, offering products supporting current semiconductor microfabrication.For a growing demand for LSIs for…

Megtron 7 PCB-Lieferant,Megtron7GN,R-5785(GN)/R-5680(GN),Megtron7GE, R-5785(GE)/R-5680(GE), Extrem geringer Verlust,Hochhitzebeständige Leiterplattenmaterialien. The ultra-low dielectric constant (Dk) and dissipation factor (Df) make MEGTRON 7 ideal for high speed and large data volumes associated with servers and routers required for 5G. The MEGTRON 7 family, einschließlich MEGTRON 7(N), THRONE MICH 7(GE) Und…

Minimum Trace&Gap PCB manufacturer. Der kleinste Abstand zwischen Leiterbahn zu Leiterbahn oder Pads zu Pads beträgt 1,4 mil(35eins). Wir bieten den kleinsten Pads Pitch mit 160um an(7.1Mil). Wie zum Beispiel FCBGA-Verpackungsprodukte.

Ro4350B-Schaltungen,Ro4350B PCB Supplier, Rogers 4350B PCB fabrication. Dk of 3.48 +/- 0.05, Verlustfaktor von 0.0037 bei 10 GHz, Fast shipping time. and more cheap price Rogers 4350b PCB Manufacturer.

Rogers 4003C PCB, Ro4003C PCB. Ro4003C Circuits.Material reference: Dk of 3.38 +/- 0.05,Verlustfaktor von 0.0027 bei 10 GHz. High quality Rogers PCB fabrication. More lower cost. and the shipping time is fast.

Ro4350B PCB, Rogers 4350B PCB Manufacturing. Dk of 3.48 +/- 0.05, Verlustfaktor von 0.0037 bei 10 GHz, High quality Rogers PCB Supplier. Fast shipping time. and Low cost. we will help you save time.