RT-Duroid 6035 Leiterplatte
RT-Duroid 6035 Leiterplatte, RT 6035 PCB-Herstellung, RT/duroid 6035HTC laminates are an exceptional choice for high power applications. The laminates have a thermal conductivity of almost 2.4 times the standard RT/duroid 6000 products, and copper foil (ED and reverse treat) with excellent long term thermal stability. Additionally, Rogers advanced filler…
RT/duroid® 5880 Leiterplatte
oid® 5880 Leiterplatte, RT5880 PCB board. Alcanta factory produce RT 5880 material Boards from 2 Schicht zu 20 Lagen. HDI RT5870 materials, RT5880 materials. RT 6002 Materialien, Cavtiy PCBs. high quality HDI PCBs, and fast shipping time.
BGA Substrates PCB
BGA Substrates PCB Fabrication. Alcanta PCB has made many 2 Schicht zu 10 layers BGA Substrates PC Board. and the drilling ways are any layers interconnection. high quality and fast shipping time.
FC-BGA Substrates
FC-BGA-Substrate (flip chip ball grid array) on a high density semiconductor package substrate allows high speed LSI chips with more functions. We have developed ultra high density wiring substrates with our original microfabrication and build-up wiring technologies, offering products supporting current semiconductor microfabrication.For a growing demand for LSIs for…
Megtron 7 PCB-Lieferant
Megtron 7 PCB-Lieferant,Megtron7GN,R-5785(GN)/R-5680(GN),Megtron7GE, R-5785(GE)/R-5680(GE), Ultra-low Loss,Highly Heat Resistant Circuit Board Materials. The ultra-low dielectric constant (Dk) and dissipation factor (Df) make MEGTRON 7 ideal for high speed and large data volumes associated with servers and routers required for 5G. The MEGTRON 7 family, including MEGTRON 7(N), MEGTRON 7(GE) Und…
Minimale Spur&Gap PCB
Minimum Trace&Gap PCB manufacturer. The smallest clearance between trace to trace or Pads to Pads are 1.4mil(35um). we offer the smallest Pads Pitch with 160um(7.1Mil). Such as FCBGA packaging products.
Tel: +86 (0)755-8524-1496
Email: info@alcantapcb.com