キャビティ基板
Buried Cavity PCB maker,組み込みデバイス PCB, Embedded Component PCB Fabrication. 高品質, Low cost and fast shipping time. ハイブリッド & 混合誘電体, Buried and Blind Vias and other Advanced production technology.
Embedded PCB. Small mobile devices feature an increasing number of passive components that require a higher-density installation. Unfortunately the surface mounting area of conventional surface-mount technology (two-dimensional implementation) is unable to support these components. That is why the three-dimensional implementation using embedded PCB technology was proposed. ALCANTA PCB independently developed a connection process using laser via and plating in addition to a bonding process using solder materials, and has a track record of mass production with both processes.
特徴
Reduction of the surfac mount area by embedding chip components(resistance/condenser).
Improvement of electrical properties by shorter wiring distance between surface-installed ICs and embedded components
Shorter pitches between components and better heat resistance enabled by connection between component terminals using laser via and copper plating
Blank Cavity PCB also is the core manufacturing service of ALCANTA PCB, さまざまな機能を備えた, 資格, certification and expertise to meet the most demanding requirements of Blank Cavity PCB fabrication. Our extensive PCB manufacturing capabilities support the stringent requirements for advanced Cavity PCB design in all industries, 医療も含めて, 航空宇宙, 防衛および商業市場. までサポートします 90 ラミネート, レーザー掘削, マイクロビアホール, 積み重ねられたマイクロビアホール, 止まり穴, 穴を通して埋められる, 経由- インパッド, レーザーダイレクトイメージング, 順次積層,. 00275 “trace / 空間, 3milの微細な間隔, 制御されたインピーダンス, 等. Able to produce Cavity PCB without minimum order requirements and flexible turn around time options. 各設計は、製造前に当社のカムエンジニアによって詳細にレビューされ、製造プロセスに問題がないことが確認されます。, サポートチームが対応可能です 24 hours a week from Monday to Saturday to assist with your Cavity PCB fabrication.