견고한 PCB 제조
견고한 PCB 제조. High Quality HDI PCB fabrication,Low cost,Fast lead time. We produce the HDI pcb with smallest gap, Buried and Blind Vias, 하이브리드 & Mixed Dielectrics and other Advanced technology and process.
HDI PCB fabrication is the core manufacturing service of ALCANTA PCB, 다양한 기능을 갖춘, 자격, certification and expertise to meet the most demanding requirements of HDI PCB fabrication. Our extensive PCB manufacturing capabilities support the stringent requirements for advanced HDI PCB design in all industries, 의료를 포함한, 항공우주, 국방 및 상업 시장. 우리는 최대 지원 90 라미네이트, 레이저 드릴링, 마이크로 비아 홀, 적층형 마이크로비아 홀, 막힌 구멍, 구멍으로 묻혀, ~을 통해- 인패드, 레이저 직접 이미징, 순차적 적층,. 00275 “추적하다 / 공간, 3mil 만큼 낮은 미세한 간격, 제어된 임피던스, 등. Able to produce HDI PCB without minimum order requirements and flexible turn around time options. 각 디자인은 생산 전에 캠 엔지니어가 자세히 검토하여 제조 공정에 대한 걱정이 없는지 확인합니다., 지원팀이 있습니다. 24 hours a week from Monday to Saturday to assist with your HDI PCB fabrication orders.
HDI is the abbreviation of high density interconnector, namely high density interconnection board. HDI board has inner circuit and outer circuit, and then uses the technology of drilling and metallization in hole to realize the internal connection of each layer circuit. 일반적으로, build-up manufacturing is used. The more times of lamination, the higher the technical grade of the board. The common HDI board is basically one-time build-up, and the high-stage HDI adopts two or more times of lamination technology, and adopts advanced PCB technologies such as stack hole, electroplating hole filling, laser direct drilling, 등. With the development of science and technology, electronic design is constantly improving the performance of the whole machine, but also trying to reduce the size. From mobile phones to smart weapons, “small” is the eternal pursuit. High density integration (HDI) technology can make the design of terminal products more miniaturized and meet the higher standards of electronic performance and efficiency.
Typical features of HDI PCB. The micro blind hole ring is less than 6mil. the wiring line width between inner and outer layers is less than 3mil and the pad diameter is no more than 0. 25mm. Blind hole: which connects the inner layer with the outer layer. Buried hole: which realizes the connection between inner layer and inner layer. All of them are small holes with a diameter of 0. 075mm ~ 0. 1mm. There are laser drilling, plasma etching and photo induced drilling. Laser drilling is usually used, and laser drilling is divided into CO2 and YAG ultraviolet laser (UV).
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