What is the Rogers 4350B High Frequency Circuit Materials?
Rogers 4350B PCB Supplier. We have made the Rogers 4350B core pcb boards from 2 layer to 30 layers. We offer ultrathin Rogers 4350B PCB, Blind & buried vias Rogers 4350B pcb, Mixed medium HDI Rogers 4350B PCBS.
We buy these materials from an agent at Rogers Materials and then process and produce blank circuit boards. We don’t produce core materials. The following information is for reference only.
RO4003™ laminates are currently offered in various confifi gurations utilizing both 1080 and 1674 glass fabric styles, with all confifi gurations meeting the same laminate electrical performance specififi cation.
as a drop-in replacement for the RO4003C™ material, RO4350B™ laminates utilize RoHS compliant flfl ame-retardant technology for applications requiring UL 94V-0 certififi cation. These materials conform to the requirements of IPC- 4103, slash sheet /10 for RO4003C and /11 for RO4350B materials.
Property | Typical Value RO4003C RO4350B | Direction | Units | Condition | Test Method | |
Dielectric Constant, er Process | 3.38 ± 0.05 | (2)3.48 ± 0.05 | Z | — | 10 GHz/23°C | IPC-TM-650 2.5.5.5 Clamped Stripline |
(1) Dielectric Constant, er Design | 3.55 | 3.66 | Z | — | 8 to 40 GHz | Differential Phase Length Method |
Dissipation Factor tan, d | 0.0027 0.0021 | 0.0037 0.0031 | Z | — | 10 GHz/23°C 2.5 GHz/23°C | IPC-TM-650 2.5.5.5 |
Thermal Coefficient of er | +40 | +50 | Z | ppm/°C | -50°C to 150°C | IPC-TM-650 2.5.5.5 |
Volume Resistivity | 1.7 X 1010 | 1.2 X 1010 | MΩ•cm | COND A | IPC-TM-650 2.5.17.1 | |
Surface Resistivity | 4.2 X 109 | 5.7 X 109 | MΩ | COND A | IPC-TM-650 2.5.17.1 | |
Electrical Strength | 31.2 (780) | 31.2 (780) | Z | KV/mm (V/mil) | 0.51mm (0.020”) | IPC-TM-650 2.5.6.2 |
Tensile Modulus | 19,650 (2,850) 19,450 (2,821) | 16,767 (2,432) 14,153, (2,053) | X Y | MPa (ksi) | RT | ASTM D638 |
Tensile Strength | 139 (20.2) 100 (14.5) | 203 (29.5) 130 (18.9) | X Y | MPa (ksi) | RT | ASTM D638 |
Flexural Strength | 276 (40) | 255 (37) | MPa (kpsi) | IPC-TM-650 2.4.4 | ||
Dimensional Stability | <0.3 | <0.5 | X,Y | mm/m (mils/inch) | after etch +E2/150°C | IPC-TM-650 2.4.39A |
Coefficient of Thermal Expansion | 11 14 46 | 10 12 32 | X Y Z | ppm/°C | -55 to 288°C | IPC-TM-650 2.4.41 |
Tg | >280 | >280 | °C DSC | A | IPC-TM-650 2.4.24 | |
Td | 425 | 390 | °C TGA | ASTM D3850 | ||
Thermal Conductivity | 0.71 | 0.69 | W/m/°K | 80°C | ASTM C518 | |
Moisture Absorption | 0.06 | 0.06 | % | 48 hrs immersion 0.060” sample Temperature 50°C | ASTM D570 | |
Density | 1.79 | 1.86 | gm/cm3 | 23°C | ASTM D792 | |
Copper Peel Strength | 1.05 (6.0) | 0.88 (5.0) | N/mm (pli) | after solder float 1 oz. EDC Foil | IPC-TM-650 2.4.8 | |
Flammability | N/A | (3)V-0 | UL 94 | |||
Lead-Free Process Compatible | Yes | Yes |
What is Rogers 4350b High frequency circuit boards?
High frequency PCB with Rogers material The increasing complexity of electronic components and switches continually requires faster signal flow rates, and thus higher transmission frequencies. Because of short pulse rise times in electronic components, it has also become necessary for high frequency (HF) technology to view conductor widths as an electronic component. Depending on various parameters, HF signals are reflected on circuit board, meaning that the impedance (dynamic resistance) varies with respect to the sending component. To prevent such capacitive effects, all parameters must be exactly specified, and implemented with the highest level of process control. Critical for the impedances in high frequency circuit boards are principally the conductor trace geometry, the layer buildup, and the dielectric constant (εr) of the materials used.
ALCANTA PCB has bought these materials from an agent at Rogers Materials and then process and produce blank circuit boards.
Materials used for HF circuit boards:
High-frequency boards, e.g. for wireless applications and data rates in the upper GHz range have special demands on the material used: Adapted permittivity Low attenuation for efficient signal transmission Homogeneous construction with low tolerances in insulation thickness and dielectric constant For many applications, it is sufficient to use FR4 material with an appropriate layer buildup. Além disso, we process high-frequency materials with improved dielectric properties. These have a very low loss factor, a low dielectric constant, and are primarily temperature and frequency independent. Additional favourable properties are high glass transition temperature, an excellent thermal durability, and very low hydrophilic rate. We use (among others) Rogers or PTFE materials (for example, Teflon from DuPont) for impedance controlled high frequency circuit boards. Sandwich buildups for material combinations are also possible.
Impedance Check: The impedance defined by the customer is tested by our CAM station engineers on manufacturability. Depending on the layer buildup, the PCB layout and the customer’s requested impedances a calculation model is chosen. The result is any required modification of the layer builduo and the necessary adjustments to the relevant conductor geometries. After the manufacture of high frequency circuit boards, the impedances are checked (with a precision of up to 5%), and the detailed results are recorded exactly in a test protocol.
What is ultrathin Rogers 4350B PCB?
Exploring the World of Ultrathin Rogers 4350B PCBs:
In the realm of modern electronics, where miniaturization and high-performance are paramount, the demand for ultrathin printed circuit boards (PCB) has surged. Among the myriad of materials available for PCB fabrication, Rogers 4350B has emerged as a top contender for applications requiring exceptional electrical performance and dimensional stability. Let’s delve into the world of ultrathin Rogers 4350B PCBs to understand their significance and applications.
Introduction to Rogers 4350B:
Rogers 4350B is a high-frequency laminate material renowned for its outstanding electrical properties, thermal stability, and mechanical strength. Composed of woven fiberglass reinforced hydrocarbon/ceramic laminate, Rogers 4350B offers a low dielectric constant (Dk) and low loss tangent (Df), making it ideal for high-frequency applications such as microwave, RF, and millimeter-wave circuits.
Characteristics of Ultrathin Rogers 4350B PCBs:
Ultrathin Rogers 4350B PCBs exhibit several notable characteristics that make them highly desirable for various advanced electronic systems:
- Reduced Thickness: One of the defining features of ultrathin Rogers 4350B PCBs is their significantly reduced thickness compared to traditional PCBs. With thicknesses ranging from 0.1mm to 0.5mm or even thinner, these PCBs enable the development of sleek and compact electronic devices without compromising on performance.
- High Electrical Performance: Despite their thin profile, ultrathin Rogers 4350B PCBs maintain exceptional electrical performance, including low loss tangent and consistent dielectric properties across a wide range of frequencies. This ensures reliable signal transmission and minimal signal distortion, critical for high-frequency applications.
- Excellent Dimensional Stability: Rogers 4350B exhibits excellent dimensional stability, even at elevated temperatures, making it well-suited for applications requiring precise impedance control and tight tolerance requirements. This ensures consistent electrical performance and reliability over a wide range of operating conditions.
- Suitability for High-Frequency Applications: Ultrathin Rogers 4350B PCBs are specifically designed to meet the stringent requirements of high-frequency circuits, including microwave and RF applications. Their low dielectric constant and low loss tangent make them ideal for use in antennas, satellite communications, radar systems, and wireless networking equipment.
Applications of Ultrathin Rogers 4350B PCBs:
The versatility and high performance of ultrathin Rogers 4350B PCBs render them indispensable in a wide range of advanced electronic applications, including but not limited to:
- Wireless Communication Systems: Ultrathin Rogers 4350B PCBs are widely used in the development of wireless communication systems such as 5G infrastructure, satellite communication systems, and high-speed data transmission equipment.
- Aerospace and Defense Electronics: In aerospace and defense applications, where reliability and performance are paramount, ultrathin Rogers 4350B PCBs are employed in radar systems, avionics, electronic warfare systems, and unmanned aerial vehicles (UAVs).
- Medical Devices: The compact size and high performance of ultrathin Rogers 4350B PCBs make them ideal for medical devices such as MRI machines, ultrasound equipment, and implantable medical devices where space constraints and signal integrity are critical considerations.
- Automotive Electronics: Na indústria automotiva, ultrathin Rogers 4350B PCBs find applications in advanced driver assistance systems (ADAS), vehicle-to-vehicle (V2V) communication systems, and automotive radar systems for enhanced safety and connectivity.
Conclusion:
Ultrathin Rogers 4350B PCBs represent a significant technological advancement in the field of high-frequency electronics, offering unparalleled electrical performance, dimensional stability, and versatility in a compact form factor. With their widespread applications across various industries, these ultrathin PCBs continue to drive innovation and enable the development of next-generation electronic systems with enhanced performance and reliability.
What is Microtrace Rogers 4350B PCB?
Exploring Microtrace Rogers 4350B PCB: Revolutionizing High-Frequency Circuitry:
Microtrace Rogers 4350B PCB represents a significant advancement in high-frequency circuitry technology, offering unparalleled performance and reliability in demanding applications. This innovative PCB material, developed by Rogers Corporation, combines the exceptional electrical properties of Rogers 4350B laminate with the precision of microtrace technology, ushering in a new era of miniaturization and high-frequency signal integrity.
At its core, Microtrace Rogers 4350B PCB is built upon Rogers 4350B laminate, a high-performance thermoset material renowned for its low dielectric constant (Dk) and low loss tangent (Df). These properties make Rogers 4350B an ideal substrate for high-frequency applications where signal integrity and minimal signal loss are paramount. By incorporating microtrace technology into Rogers 4350B laminate, Microtrace Rogers 4350B PCB achieves even greater precision and performance, making it a preferred choice for a wide range of industries including aerospace, telecommunications, and automotive.
Microtrace technology involves the precise fabrication of ultra-fine circuit traces and features on the PCB surface, allowing for higher circuit density and improved signal transmission. This technology enables designers to achieve smaller, lighter, and more efficient electronic devices without compromising on performance. With Microtrace Rogers 4350B PCB, designers can create intricate circuitry with minimal line widths and spacing, pushing the boundaries of high-frequency design and enabling next-generation electronic systems.
One of the key benefits of Microtrace Rogers 4350B PCB is its ability to support miniaturization without sacrificing performance. By reducing the size of circuit traces and features, Microtrace technology allows for higher packing densities, enabling the integration of more functionality into smaller form factors. This is particularly advantageous in applications where space is limited, such as mobile devices, wearable electronics, and IoT sensors. Microtrace Rogers 4350B PCB empowers designers to create compact, lightweight, and energy-efficient products without compromising on functionality or reliability.
Furthermore, Microtrace Rogers 4350B PCB offers enhanced signal integrity and stability, thanks to the superior electrical properties of Rogers 4350B laminate. The low Dk and Df of Rogers 4350B ensure minimal signal loss and distortion, resulting in cleaner, more accurate signal transmission across high-frequency circuits. This is crucial for applications such as high-speed data communication, RF/microwave systems, and radar systems, where signal fidelity is critical for optimal performance.
In addition to its electrical properties, Microtrace Rogers 4350B PCB exhibits excellent mechanical and thermal stability, making it suitable for harsh operating environments. The robust construction of Rogers 4350B laminate provides exceptional resistance to moisture, chemicals, and temperature fluctuations, ensuring long-term reliability and durability in challenging conditions.
In conclusion, Microtrace Rogers 4350B PCB represents a groundbreaking advancement in high-frequency circuitry technology, combining the exceptional electrical properties of Rogers 4350B laminate with the precision of microtrace technology. By enabling miniaturization, improving signal integrity, and enhancing reliability, Microtrace Rogers 4350B PCB opens up new possibilities for high-frequency design and innovation across various industries. As the demand for smaller, faster, and more efficient electronic devices continues to grow, Microtrace Rogers 4350B PCB stands poised to lead the way towards a future of high-performance, miniaturized electronics.
What is Mixed medium Rogers PCB?
Mixed Medium Rogers PCB: Bridging the Gap Between High-Frequency and Conventional Circuitry
In the realm of printed circuit boards (PCB), the demand for versatile solutions that can accommodate both high-frequency and conventional circuitry has led to the emergence of mixed medium Rogers PCBs. These innovative PCBs combine the high-performance characteristics of Rogers laminate materials with traditional FR-4 substrates, offering a balanced approach to meet the diverse needs of modern electronic designs.
At its core, mixed medium Rogers PCBs leverage the exceptional electrical properties of Rogers laminates, such as Rogers 4350B, which are renowned for their low dielectric constant (Dk) and low loss tangent (Df). These properties make Rogers laminates ideal for high-frequency applications, where signal integrity and minimal loss are critical. By incorporating Rogers laminate layers into the PCB stackup, mixed medium Rogers PCBs ensure superior high-frequency performance, enabling efficient signal transmission and reduced electromagnetic interference (EMI).
No entanto, mixed medium Rogers PCBs also integrate traditional FR-4 layers into their construction. FR-4 is a widely used substrate material known for its cost-effectiveness, mechanical strength, and ease of fabrication. By combining Rogers laminates with FR-4 layers, mixed medium PCBs strike a balance between high-frequency performance and conventional circuitry requirements. This hybrid approach allows designers to integrate both high-frequency and low-frequency components onto a single PCB, reducing complexity and optimizing space utilization.
The construction of mixed medium Rogers PCBs involves careful consideration of layer stackup and material selection. Tipicamente, the high-frequency signal layers utilize Rogers laminates, while the inner and outer layers for low-frequency components employ FR-4 material. This strategic layer arrangement ensures that high-frequency signals propagate efficiently through the Rogers layers, while low-frequency signals are adequately routed through the FR-4 layers.
One of the key advantages of mixed medium Rogers PCBs is their versatility. These PCBs can accommodate a wide range of applications, from high-speed data communication and RF/microwave systems to power electronics and control circuits. By providing a seamless transition between high-frequency and conventional circuitry, mixed medium Rogers PCBs offer designers the flexibility to optimize performance and cost according to specific project requirements.
Furthermore, mixed medium Rogers PCBs offer enhanced reliability and thermal performance. The combination of Rogers laminates with FR-4 layers results in improved thermal conductivity and heat dissipation, ensuring efficient operation even under high-power conditions. This is particularly beneficial for applications that require prolonged operation at elevated temperatures, such as automotive electronics and industrial controls.
Additionally, mixed medium Rogers PCBs streamline the manufacturing process by eliminating the need for separate high-frequency and conventional PCBs. This reduces assembly time, material costs, and potential points of failure, ultimately leading to faster time-to-market and lower overall production costs.
In conclusion, mixed medium Rogers PCBs represent a versatile and cost-effective solution for modern electronic designs that require a balance between high-frequency performance and conventional circuitry. By leveraging the unique characteristics of Rogers laminates and FR-4 substrates, these PCBs offer superior signal integrity, confiabilidade, and thermal performance across a wide range of applications. As the demand for high-performance, multi-functional electronic devices continues to grow, mixed medium Rogers PCBs are poised to play a crucial role in enabling innovation and driving progress in the electronics industry.