What is Rogers RT/duroid 5880 Leiterplatte?
Rogers RT/duroid 5880 PCB-Lieferant. RT/duroid® 5880 laminates has a low dielectric constant (Dk) and low dielectric loss, making them well suited for high frequency/broadband applications. Helping to maintain the Dk uniformity are the randomly oriented microfibers reinforcing the PTFE composites. we have used the Rogers RT/duroid 5880 materials to make the small gap PCBs, Hohlraum-Leiterplatten. HDI-Leiterplatten. great quality and fast lead time.
We buy these materials from an agent at Rogers Materials company and then process and produce blank circuit boards.
Merkmale
- Dk or 2.20 +/- .02
- Dissipation factor of .0009 at 10GHz
- Low moisture absorption
- Isotropic
Benefits
- Uniform electrical properties over wide frequency range
- Easily cut, shared and machined to shape
- Resistant to solvents and reagents used in etching or plating edges and holes
- Ideal for high moisture environments
- Well-established material
- Lowest electrical loss for reinforced PTFE material
Standard thickness:
0.005” (0.127mm)
0.010” (0.254mm)
0.015” (0.381mm)
0.020” (0.508mm)
0.031” (0.787mm)
0.062” (1.575mm)
0.125” (3.175mm)
Rogers RT5880 Application:
Commercial aviation telephone circuit
Microstrip and strip circuit
Millimeter wave applications
Missile guidance system
Point-to-point digital radio antennas
RT/duroid® 5870 Und 5880 glass microfi ber reinforced PTFE composites are designed for exacting stripline and mi crostrip circuit applications.The randomly oriented microfi bers result in exceptional dielectric constant uniformity. The dielectric constant of RT/duroid 5870 Und 5880 laminates is uniform from panel to panel and is constant over a wide frequency range.Its low dissipation factor extends the usefulness of RT/duroid 5870 Und 5880 laminates to Ku-band and above.RT/duroid 5870 Und 5880 laminates are easily cut, sheared and machined to shape. They are resistant to all solvents and reagents, hot or cold, normally used in etching printed
circuits or in plating edges and holes. Normally supplied as a laminate with electrodeposited copper of ½ to 2 ounces/ ft.2 (8 to 70m) or reverse treated EDC on both sides, RT/duroid 5870 Und 5880 composites can
also be clad with rolled copper foil for more critical electrical applications. Cladding with aluminum, copper or brass plate may also be specifi ed. When ordering RT/duroid 5870 Und 5880 Laminate, it is important to specify dielectric thickness, tolerance, rolled, electrodeposited or reverse treated copper foil, and weight of copper foil required.
How to manufacturing Rogers 5880 PCB？
Unveiling the Manufacturing Process of Rogers 5880 Leiterplatte:
Rogers 5880 is a high-frequency laminate material widely used in the fabrication of printed circuit boards (Leiterplatten) for applications demanding superior performance in high-frequency and high-speed signal transmission. The manufacturing process of Rogers 5880 PCBs involves several precise steps and specialized techniques to ensure optimal electrical performance and reliability.
Material Selection: The process begins with the careful selection of Rogers 5880 laminate material. Rogers 5880 is a high-performance thermoset material with a low dielectric constant and loss tangent, making it ideal for high-frequency applications. The material is chosen based on the specific requirements of the PCB design and the desired electrical properties.
Preparation of Substrate: The selected Rogers 5880 laminate sheets are then prepared for the fabrication process. This involves cutting the laminate into the required size and shape according to the dimensions of the PCB design.
Copper Cladding: Nächste, the substrate undergoes a copper cladding process. Thin layers of copper foil are bonded to both sides of the Rogers 5880 laminate sheets using an adhesive. The copper foil serves as the conductive layer for the PCB, allowing for the routing of electrical signals.
Circuit Patterning: The copper-clad Rogers 5880 substrate is then subjected to a process known as circuit patterning. This involves applying a layer of photoresist material onto the copper surface, followed by exposure to ultraviolet (UV) light through a photomask. The UV light selectively hardens the photoresist, creating a pattern that corresponds to the desired circuit layout.
Etching: After patterning, the substrate undergoes an etching process to remove the unwanted copper material. Chemical etchants are applied to dissolve the exposed copper areas, leaving behind the desired circuit traces as defined by the patterned photoresist.
Drilling: Precision drilling is performed to create holes, known as vias, that establish electrical connections between different layers of the PCB. High-speed, automated drilling machines are used to accurately drill the vias according to the PCB design specifications.
Plating and Surface Finishing: The drilled vias are plated with conductive material, typically copper, to ensure electrical continuity between layers. Surface finishing techniques such as immersion gold, ZUSTIMMEN (Chemisches Nickel-Immersionsgold), or HASL (Heißluft-Lotnivellierung) may be applied to protect the exposed copper surfaces from oxidation and provide a solderable finish.
Final Inspection and Testing: Once the fabrication process is complete, the Rogers 5880 PCB undergoes thorough inspection and testing to verify its quality and performance. This includes visual inspection, dimensional measurements, electrical continuity testing, and signal integrity analysis.
In conclusion, the manufacturing process of Rogers 5880 PCBs involves a series of meticulous steps and specialized techniques to achieve high-quality, high-performance circuit boards suitable for a wide range of high-frequency applications. By adhering to strict quality standards and leveraging advanced manufacturing technologies, manufacturers can ensure the reliability and functionality of Rogers 5880 PCBs in demanding electronic systems.
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