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Bt laminate PCB manufacturing. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.or other types high.

Fabricação de substrato de cavidade. High speed and high frequency material Cavity packaging substrate manufacturing. Advanced cavity(slot) production technique. we make the cavity PCBs from 4 camada para 30 camadas.

Bt laminate substrate manufacturing, Produzimos principalmente substrato de pitch bump ultra-pequeno, Substrato de embalagem de traço e espaçamento ultra-pequeno.

Ultrathin BT PCB manufacturing, we mainly produce Ultrathin and ultra-small bump pitch BGA substrate, ultra-small trace and spacing LED PCBs, and other types BGA package substrate.

Professional Low CET PCB manufacturing, Produzimos principalmente substrato de pitch bump ultra-pequeno, ultra-small trace and spacing PCB and package substrate.

Ultrathin BT PCB manufacturing. we can produce the best samllest thin PCB with 0.07mm, the best smallest trace and spacing are 9um/9um.