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Fabricante de embalagens de substrato. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 para 18 camadas,

Principal 10 Fabricante de substrato de embalagem, Produzimos principalmente substrato de pitch bump ultra-pequeno, ultra-small trace packaging substrate from 2~20L

Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 camada para 20 camadas.

Global Packaging Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Principal 10 package Substrate Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 camada para 20 camadas.

Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.