Company News Archives - Page 44 of 86 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD

Semiconductor BGA substrates Manufacturer
March 12, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Semiconductor BGA substrate Manufacturer, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate
Read more
Semiconductor IC substrate Manufacturer
March 11, 2024 Habari za Kampuni / Habari / Taarifa / Habari za Biashara
Semiconductor IC substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.
Read more
Ceramic package substrate Manufacturer
March 8, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Ceramic package substrate Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers
Read more
Substrate package Manufacturer
March 7, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.
Read more
Substrate Packaging Manufacturer
March 6, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Substrate Packaging Manufacturer. We use advanced Msap and Sap technology, High multilayer interconnection substrates from 4 to 18 layers,
Read more
Top 10 Packaging Substrate Manufacturer
March 5, 2024 Habari za Kampuni / Habari / Taarifa / Maonyesho / Habari za Biashara
Top 10 Packaging Substrate Manufacturer, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace packaging substrate from 2~20L
Read more