Nyaraka za Habari za Kampuni - Ukurasa 44 ya 86 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 44

Rigid-flex packaging substrate Firm. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates.

Semiconductor FC-BGA substrate Manufacturer. Tunatumia teknolojia ya hali ya juu ya MSAP na SAP, High multilayer interconnection.

Semiconductor BGA substrate Manufacturer, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate

Semiconductor IC substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Ceramic package substrate Manufacturer. Tunatumia teknolojia ya hali ya juu ya MSAP na SAP, Sehemu ndogo za unganisho za multilayer kutoka 4 kwa 18 tabaka

Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.