Nyaraka za Habari za Kampuni - Ukurasa 44 ya 86 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 44

Rigid-flex packaging substrate Firm. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates.

Semiconductor FC-BGA Substrate Mtengenezaji. Tunatumia teknolojia ya hali ya juu ya MSAP na SAP, Muunganisho wa juu wa tabaka nyingi.

Semiconductor BGA substrate Manufacturer, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate

Semiconductor IC substrate Manufacturer. tunaweza kutoa lami bora zaidi ya samllest na 100um, alama ndogo zaidi ni 9um.

Ceramic package substrate Manufacturer. Tunatumia teknolojia ya hali ya juu ya MSAP na SAP, Sehemu ndogo za unganisho za multilayer kutoka 4 kwa 18 tabaka

Substrate package Manufacturer.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.