Nyaraka za Habari za Kampuni - Ukurasa 45 ya 86 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 45

Mtengenezaji wa ufungaji wa substrate. Tunatumia teknolojia ya hali ya juu ya MSAP na SAP, Sehemu ndogo za unganisho za multilayer kutoka 4 kwa 18 tabaka,

Juu 10 Ufungaji wa mtengenezaji wa substrate, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace packaging substrate from 2~20L

Professional Organic Packaging Chip Substrates Manufacturer, we mainly produce ultra-small bump pitch substrate from 4 Tabaka kwa 20 tabaka.

Global Packaging Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Juu 10 package Substrate Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 6 Tabaka kwa 20 tabaka.

Global Semiconductor packaging Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.