Global package Substrate Manufacturer
Global package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production.
Module Substrates Manufacturer
Module Substrates Manufacturer, 초소형 범프 피치 기판을 주로 생산하고 있습니다., ultra-small trace and PCBs from 4 레이어 20 레이어.
Global Semiconductor Substrate Manufacturer
Global Semiconductor Substrate Manufacturer. We use advanced Msap and Sap technology to manufacturing High multilayer interconnection package substrates.
CPCORE Structure Manufacturer
CPCORE Structure Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 4 에게 18 레이어.FC-CSP 기판 제조업체
FC-CSP 기판 제조업체. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. or other types base materials.
High Speed package Substrate Manufacturer
High Speed package Substrate Manufacturer. High speed and high frequency material PCB and packaging substrate manufacturing.
전화: +86 (0)755-8524-1496
이메일: info@alcantapcb.com