SHDBU 기판 제조업체
SHDBU 기판 제조업체. We use advanced Msap and Sap technology to produce the High multilayer interconnection package substrates from 4 에게 20 레이어.
High precision packaging substrate Manufacturer
High precision packaging substrate Manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. or other high quality base package substrate or PCB boards materials.
High Frequency package Substrate Manufacturer
High Frequency package Substrate Manufacturer. the Package Substrate will be made with Rogers materials(High Frequency base). or Showa Denko, Ajinomoto High speed materials.
Organic Package Manufacturer
Organic Package Manufacturer. the Package Substrate will be made with BT, 로저스, Showa Denko and Ajinomoto High speed materials. We also offer Organic Package service.
유기기판 FC BGA 기판 제조사
유기기판 FC BGA 기판 제조사. High speed and high frequency material packaging substrate manufacturing.
임베디드 캐비티 기판 제조업체
Professional Embedded Cavity Substrate Manufacturer, we mainly produce Embedded Cavity PCB and Embedded Cavity Substrates. to use the BT base and rogers baes or other types High frequency and high speed substrate materials.
전화: +86 (0)755-8524-1496
이메일: info@alcantapcb.com