BGA Cavity Substrate Manufacturer
BGA Cavity Substrate Manufacturer. We are professional Cavity PCB & Embedded components and parts substrates company. We can do the cavity slot with the Mixed dielectric layer.
Organic Packaging Manufacturer
Organic Packaging Manufacturer. We use advanced Msap and Sap technology to make the High multilayer interconnection package substrates from 4 に 20 レイヤー. and our company also do the Organic Packaging service.
BT FCCSP Package Substrate Manufacturer
BT FCCSP Package Substrate Manufacturer. the Package Substrate will be made with BT base, Showa Denko and Ajinomoto High speed materials. or other types High speed and high frequency materials.
CSP package substrate Manufacturer
CSP package substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate firm.
フリップチップCSPパッケージ基板メーカー
フリップチップCSPパッケージ基板メーカー. High speed and high frequency material packaging substrate manufacturing.Advanced technology and equipments.
ワイヤーボンド基板メーカー
ワイヤーボンド基板専門メーカー, 極小バンプピッチ基板を主に生産しております, ultra-small trace and led PCBs from 2 レイヤーに 20 レイヤー.
電話番号: +86 (0)755-8524-1496
Eメール: info@alcantapcb.com