Global package Substrate Manufacturer
Global package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate production.
Module Substrates Manufacturer
Module Substrates Manufacturer, 極小バンプピッチ基板を主に生産しております, ultra-small trace and PCBs from 4 レイヤーに 20 レイヤー.
世界的な半導体基板メーカー
世界的な半導体基板メーカー. We use advanced Msap and Sap technology to manufacturing High multilayer interconnection package substrates.
CPCORE Structure Manufacturer
CPCORE Structure Manufacturer. We use advanced Msap and Sap technology to produce the High multilayer interconnection substrates from 4 に 18 レイヤー.FC-CSP基板メーカー
FC-CSP基板メーカー. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials. or other types base materials.
高速パッケージ基板メーカー
High Speed package Substrate Manufacturer. High speed and high frequency material PCB and packaging substrate manufacturing.
電話番号: +86 (0)755-8524-1496
Eメール: info@alcantapcb.com