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FLIP CHIP CSP (FCCSP) Empresa. We produce the High speed and high frequency material packaging substrate from 2 camada para 20 camadas. we also offer the Flip Chip CSP package service.

Ceramic package substrate Manufacturer, Fornecedor de placa de circuito cerâmico e substratos de pacote BGA cerâmico. oferecemos PCBs cerâmicos microtrace/microgap HDI e substratos cerâmicos BGA de 1 camada para 30 camadas.

Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Semiconductor FC BGA substrate quote. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

We are a professional Rigid-flex BGA substrate quote, Produzimos principalmente substrato de pitch bump ultra-pequeno, ultra-small trace and PCBs.

We are a professional Rigid-flex packaging substrate quote supplier, Produzimos principalmente substrato de pitch bump ultra-pequeno, ultra-small trace.