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Advance Semiconductor substrate manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Advanced packaging substrate manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Rigid-flex BGA substrate manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Ceramic package substrate. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.

Rigid-Flex BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

We are a professional ABF Substrate Manufacturer, Produzimos principalmente substrato de pitch bump ultra-pequeno, Substrato de embalagem de traço e espaçamento ultra-pequeno.