Arquivos de notícias da empresa - Página 54 de 86 - TECNOLOGIA ALCANTA(SHENZHEN)CO., LTD - Página 54

Professional Flip-Chip Package Substrate Manufacturer. we offer Flip Chip Packaging Substrate from 4 camada para 18 camadas. the smallest pitch are 100um. the smallest trace and spacing are 9um/9um.

What is the FC BGA Package? FC BGA Package Reference Guide. and How Much Does FC BGA Packaging Cost? We offer FC BGA from 4 camada para 18 layer

Alcanta substrate company has made many high High multilayer Flip-Chip Package Substrates. Such as: 10 layer Flip-Chip Package Substrates. 12 layer. 14 layer. ou 16 layers substrates. the drilling ways is anylayer connect. the best sallest via size is 50um. we can use the Msap or Sap technology to make…

Ultra-Small Pitch Substrate manufacturer. Ultra-Small Spacing PCB manufacture. The Substrate was made with advanced Msap or Sap technology. So. we can produce 9um/9um trace/spacing Substrate or PCBs. the lead time is fast. and Stable quality!

Advanced Package Substrate manufacturer. We have used Msap and Sap technological process to produce the Package substrates with the Rogers Materials BT Materials, ABF Materials, and other types Materials. The range of main layers of our products is from 4 camada para 18 camadas. our company asways made the 10…

Waht's the MSAP and SAP Processes.We have used the Multilayer Sequential Build-Up (Map) e processos semi-aditivos (SEIVA). Para fazer os traços/espaçamento com substratos de embalagem BGA 9UM/9UM FC. Essas metodologias inovadoras revolucionaram a produção de PCB, Oferecendo recursos incomparáveis ​​que impulsionam a indústria a novos patamares de inovação e eficiência.