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Waht's the MSAP and SAP Processes.We have used the Multilayer Sequential Build-Up (Map) e processos semi-aditivos (SEIVA). Para fazer os traços/espaçamento com substratos de embalagem BGA 9UM/9UM FC. Essas metodologias inovadoras revolucionaram a produção de PCB, Oferecendo recursos incomparáveis ​​que impulsionam a indústria a novos patamares de inovação e eficiência.

Fornecedor de substrato de embalagem FC BGA. Usamos a tecnologia Msap e Sap para produzir o menor substrato de embalagem com intervalo de 9um. e a largura das linhas também é 9um. podemos produzir o substrato de embalagem FC BGA a partir de 2 camada para 16 camadas. the best smallest via holes size…

Flip Chip Package Substrate suppliers.We have used the Msap and Sap technology to produce the Flip Chip Package Substrates from 4 L to 16 camadas. The substrates base(essencial) materials are the BT base materials. ABF base materials. High frequency and high speed materials. e outros. Our company offer high quality…

Flip Chip Packaging Substrate Manufacturing. 90% of our production equipments were purchased in Japan. We use advanced manufacturing equipment to produce ultra-small spacing substrates. Como: 10 layer Package Substrates. 12 Layer Package Substrates. 18 layer Package Substrates. If your substrate schematic design specification, it is easier to produce a…

Flip-Chip Package Substrate manufacturers. FC BGA Package Substrate Suppliers. We have made ABF base Package Substrates from 4 camada para 18 camadas. Ultra-small line width/line spacing with 9um/ 9um. and small size BGA pads. and More bigger than 20um line width and line spacing will be easier to produce. we…

Build-up Structure FC-BGA/Organic-package , ABF Substrates Supplier leads the industry as a premier manufacturer.With expertise spanning from 4-layer to 14-layer designs, our commitment to excellence is evident in our smallest gap ABF substrates. Employing the SAP technology, we harness the power of ABF base materials to deliver unparalleled quality.