Nyaraka za Habari za Kampuni - Ukurasa 54 ya 86 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 54

We have made Quick-turn-circuit-boards. to produce the quick turn boards. we only need 1 au 2 siku. the PCB via holes are 0.15mm. line to line spacing is 0.08mm. pcb boards thick is 0.2mm to 3.0mm. pcb copper thick is 35um to 210um. about the pcb soldermask colour. we can…

Professional Flip-Chip Package Substrate Manufacturer. we offer Flip Chip Packaging Substrate from 4 Tabaka kwa 18 tabaka. the smallest pitch are 100um. the smallest trace and spacing are 9um/9um.

Je! Ni nini kifurushi cha FC BGA? FC BGA Package Reference Guide. and How Much Does FC BGA Packaging Cost? We offer FC BGA from 4 Tabaka kwa 18 layer

Alcanta substrate company has made many high High multilayer Flip-Chip Package Substrates. Kama: 10 layer Flip-Chip Package Substrates. 12 layer. 14 layer. au 16 layers substrates. the drilling ways is anylayer connect. the best sallest via size is 50um. we can use the Msap or Sap technology to make…

Ultra-Small Pitch Substrate manufacturer. Ultra-Small Spacing PCB manufacture. The Substrate was made with advanced Msap or Sap technology. Kwa hivyo. we can produce 9um/9um trace/spacing Substrate or PCBs. the lead time is fast. and Stable quality!

Mtengenezaji wa Substrate ya Kifurushi cha hali ya juu. Tumetumia mchakato wa kiteknolojia wa Msap na Sap kutengeneza substrates za Package na Rogers Materials BT Materials., Nyenzo za ABF, na aina nyingine Nyenzo. mbalimbali ya tabaka kuu ya bidhaa zetu ni kutoka 4 Tabaka kwa 18 tabaka. our company asways made the 10…