Nyaraka za Habari za Kampuni - Ukurasa 52 ya 86 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 52

Advance Semiconductor substrate manufacturer. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Mtengenezaji wa hali ya juu wa ufungaji. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

Rigid-flex BGA substrate manufacturer. tunaweza kutoa lami bora zaidi ya samllest na 100um, alama ndogo zaidi ni 9um.

Sehemu ndogo ya kifurushi cha kauri. tunaweza kutoa lami bora zaidi ya samllest na 100um, alama ndogo zaidi ni 9um.

Rigid-Flex BGA Substrate. the Package Substrate will be made with Showa Denko and Ajinomoto High speed materials.

We are a professional ABF Substrate Manufacturer, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and spacing packaging substrate.