Nyaraka za Habari za Kampuni - Ukurasa 50 ya 86 - TEKNOLOJIA YA ALCANTA(SHENZHEN)CO., LTD - Ukurasa 50

Flip Chip CSP (FCCSP) Thabiti. Tunazalisha kasi ya juu na kiwango cha juu cha vifaa vya ufungaji kutoka 2 Tabaka kwa 20 tabaka. Tunatoa pia huduma ya kifurushi cha Flip Chip CSP.

Ceramic package substrate Manufacturer, Bodi ya mzunguko wa kauri na sehemu ndogo za kifurushi cha BGA za kauri. tunatoa microtrace/microgap HDI Ceramic PCBs na kauri BGA substrates kutoka 1 Tabaka kwa 30 tabaka.

Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Semiconductor FC BGA substrate quote. tunaweza kutoa lami bora zaidi ya samllest na 100um, alama ndogo zaidi ni 9um.

We are a professional Rigid-flex BGA substrate quote, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace and PCBs.

We are a professional Rigid-flex packaging substrate quote supplier, sisi hasa kuzalisha Ultra-ndogo mapema lami substrate, ultra-small trace.