Producător de substrat de pachete BT FCCSP
Producător de substrat de pachete BT FCCSP. the Package Substrate will be made with BT base, Showa Denko and Ajinomoto High speed materials. or other types High speed and high frequency materials.
Producător de substrat de pachete CSP
Producător de substrat de pachete CSP. High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate firm.
Flip Chip CSP Package Substrate Manufacturer
Flip Chip CSP Package Substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing.Advanced technology and equipments.
Producător de substrat de obligațiuni de sârmă
Professional Wire Bond Substrate Manufacturer, we mainly produce ultra-small bump pitch substrate, ultra-small trace and led PCBs from 2 strat la 20 straturi.
Cavity Substrate PCB Manufacturer
Cavity Substrate PCB Manufacturer. High speed and high frequency material cavity packaging substrate and Cavity PCB boards manufacturing. Advanced production technology.
Chip-scale package Manufacturer
Chip-scale package and scale package substrates Manufacturer. High speed and high frequency material packaging substrate manufacturing. Advanced packaging service vendor.
Tel: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com