Producător de pachete ecologice
Producător de pachete ecologice. the Package Substrate will be made with BT, Rogers, Showa Denko and Ajinomoto High speed materials. We also offer Organic Package service.
Organic Substrate FC BGA substrate Manufacturer
Organic Substrate FC BGA substrate Manufacturer. High speed and high frequency material packaging substrate manufacturing.
Embedded Cavity Substrate Manufacturer
Professional Embedded Cavity Substrate Manufacturer, we mainly produce Embedded Cavity PCB and Embedded Cavity Substrates. to use the BT base and rogers baes or other types High frequency and high speed substrate materials.
FCCSP Flip Chip Package Substrate
FCCSP Flip Chip Package Substrate Manufacturer. we can produce the best samllest bump pitch with 100um, the best smallest trace and spacing are 9um/9um. Use the Ajinomoto(ABF) base material or other types High frequency and high speed substrate materials.
BGA Cavity Substrate Manufacturer
BGA Cavity Substrate Manufacturer. We are professional Cavity PCB & Embedded components and parts substrates company. We can do the cavity slot with the Mixed dielectric layer.
Producător de ambalaje organice
Producător de ambalaje organice. We use advanced Msap and Sap technology to make the High multilayer interconnection package substrates from 4 la 20 straturi. and our company also do the Organic Packaging service.
Tel: +86 (0)755-8524-1496
E-mail: info@alcantapcb.com