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FCCSP Flip Chip CSP pachet substraturi Producator. Folosim tehnologia avansată Msap și Sap pentru a produce substraturi de pachete FCCSP Flip Chip CSP cu interconexiune multistrat înalt. și facem, de asemenea, serviciul de pachete FCCSP.

Producător de substrat pentru PCB cu cavitate. Professional Cavity PCB and Embedded component substrates factory. We use advanced embedded production processes.

Flip Chip CSP (FCCSP) Firm. We produce the High speed and high frequency material packaging substrate from 2 strat la 20 straturi. we also offer the Flip Chip CSP package service.

Ceramic package substrate Manufacturer, Ceramic circuit board and Ceramic BGA package substrates Vendor. we offer microtrace/microgap HDI Ceramic PCBs and Ceramic BGA substrates from 1 strat la 30 straturi.

Semiconductor BGA substrate quote.High speed and high frequency material packaging substrate manufacturing. Advanced packaging substrate.

Semiconductor FC BGA substrate quote. we can produce the best samllest bump pitch with 100um, the best smallest trace are 9um.